Pulseplating - Pulse and Pulse Reverse power supplies
Innovation in pulse technology for industry and research
Since its foundation, plating electronic has been one of the pioneers and innovation drivers of pulse and pulse-reverse processes with its POWER PULSE power supplies. As a partner of customers from industry and research, we have not only developed the power supply for electrochemical processes, research facilities and laboratories over the years. Through our holistic approach, we have also been able to improve and optimise processes and plants in general through pulse and pulse-reverse processes. Only in this way was it possible for the superior process to establish itself in more and more areas of application and industries.
Better results through pulse and pulse-reverse methods
Pulse technology has proven its advantages in numerous demanding applications, e.g. aerospace. Pulse deposition provides more exact results for high-performance functional and decorative coatings. It ensures the production of denser, pore-free and corrosion-stable alloy layers. This pulsing process ensures extremely uniform coatings, even with complex workpiece geometries. The resulting coating characteristics e.g. hardness, can also be specifically improved. The combination with dispersion coating makes it possible to provide coatings with further, specific properties.
More effective processes through pulse technology
Further advantages of the pulse and pulse-reverse processes are a shorter processing time with higher plant throughput at the same time. High-quality raw materials can be used more economically due to lower layer thicknesses. Finally, mechanical post-processing is also significantly lower due to the use of pulse current sources.
This has all led to the technology expanding away from its origins in wafer production, to the PCB industry and precious metal plating, and becoming ever more widespread.
plating electronic on top of development
This is why we continue to pursue the questions: how can we optimise the electrochemical process, achieve even better results, and improve energy efficiency? The keys are increasingly precise control of pulse sequences and the ideal combination of the process variables, current density, polarity, work cycles and frequencies. This lead to metallic layers with even more specific characteristics. By precise periodic switch off or polarity changing of the applied DC voltage at the electrolyte and the generation of current surges will effectively generate spores for metal deposition on the workpiece. These are the basic requirements for a fine-grained deposition and a shining surface. At the same time, the electroplating system hardware design has to be improved: the chemistry, the bath components, the power supply lines, the power supply, the control unit and the controller connection. The ideal process is based on the optimal combination of these components.
How would you like to use pulse technology?
plating electronic is a world leader for developing pulse reverse power supplies and their applications. We are therefore your ideal contact when it is a case of improving your pulse plating system or if you want to start out from scratch in this future-oriented technology. You too can benefit from the potential of sophisticated pulse plating technology - with a partner who knows pulse current sources like no other.
You can order the latest Pulse-Plating-book, written in collaboration with our pulse-specialists.